Improving the usability of piezoresistive bond lines in wood by using impedance measurements

Improving the usability of piezoresistive bond lines in wood by using impedance measurements

Various studies on wood adhesives filled with conductive fillers for future application to structural monitoring showed a piezoresistive (resistance change with strain) response of the adhesive bond lines that is measurable under direct current. The results also showed a relatively high signal noise with low sensitivity. Using impedance spectroscopy as a measurement technique, the improvements in frequency-dependent piezoresistivity over DC (Direct Current) resistography of multifunctional bonded wood were studied. Beech specimens were bonded by one-component polyurethane prepolymer (1C-PUR) filled with carbon black and tested under shear load. The quality of the piezoresistive properties was described by calculating the signal-to-noise ratio (SNR) of the measured signal. A setup-specific frequency band with optimized SNR between 100 kHz and 1 MHz could be derived from the measurements. Several frequencies showed a signal with higher quality resulting in a higher SNR. Regardless of the variations in impedance spectra for all specimens, this frequency band provided several frequencies with improved signal quality. These frequencies give a more reliable signal with lower noise compared to the signal from DC resistography.

 

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Sciospec ISX-3
Class-Leading Impedance analyzer, the Sciospec ISX-3

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